The FF70 CL is distinguished by its large inspection area of 510 x 610 mm and the extreme detail defectability of < 150 nm, making it ideal for automatically and non-destructively analyzing solder bumps and filled vias in 3D ICs, flip chips, and wafers.
The innovative vacuum mechanism of the system manipulator holds the sample securely and precisely during analysis and counteracts the effects of sample warpage.
The FF70 CL provides 2D (top-down) with a high-performance flat-panel and 3D (CL-Computed Laminography) auto-mated analysis using a high-resolution Image Intensifier within a special manipulation assembly for its inclined rotations.
Your benefits for semiconductor production
- Improved quality monitoring – inspect more locations at a better resolution to identify failures that otherwise could be missed.
- Significant cost reduction through better test coverage leading to improved yield.
- Reliable and reproducible check of consistency of process and defect parameters at any time. This innovative automated analysis solution is easy to use, optimizing cost of operation.
Click the link below to download the machine features:
Contact us at (049) 544-1111 or email us at sales@edgeworthcorp.com for more details.
The CREATOR 3D metal printer directly builds metal parts and components 
with highly complex geometries, eliminating the requirement for mold tools.
APPLICATIONS:
- Dental and Medical
- Jewelry
- Aerospace
- Engineering
- Education
Click this link to download the specifications:
Contact us at (049) 544-1111 or email us at sales@edgeworthcorp.com for more details.
Highlights
- Motor traverse in x/y/z and r-axis
- Teach-in function
- Autoweld (CNC control)
- Direct laser beam source
- Low oscillation due to the high-quality rail system
Click the link below to download the specifications:
Contact us at (049) 544-1111 or email us at sales@edgeworthcorp.com for more details.
Monitor ESD in Real-Time
Electrostatic Discharge (ESD) damage is a common problem for all semiconductor manufacturing facilities. ESD will continue to plague manufacturing floors as devices continue to shrink with greater functionality. With smaller devices, less energy is required in an ESD event to cause device damage. Unfortunately, grounding conductors, ionizing non-conductors, special handling materials, and manual monitoring can only do so much to prevent these ESD events that occur in a period of 1 – 10 nanoseconds. Therefore, constant audits and updates to ESD controls have become a large part of manufacturing operations, leading to more resource requirements and operating demands. At MCT, we understand the risk that an ESD event is significant and growing.
MCT’s ESD Solution
Our approach and solution to ESD is real-time monitoring and event prevention. MCT has a commercially proven, closed-loop ESD monitoring and ionization system for our SH-5000 and SH-5300 Strip Test Handlers. Our solution allows the operator to simultaneously detect, measure, record, and monitor electrostatic voltage based on limits set by the operator.
The MCT ionizer solution reduces the chance of an ESD incident and reduces the engineering time spent during manual monitoring. It helps prevent shipping damage product.
Customers, particularly in the automotive space, that have our ESD monitoring system installed in their SH machines have experienced a significant decrease in ESD incidents. This is only possible due to our success in developing machines, kits, and tools for testing at extreme temperatures required for automotive devices.
Click the link below to view the comparison table of MCT solution versus a conventional ionizer:
Features:
- Achieve shorter test times compared to humidity resistance tests under ordinary pressure.
- Available in two larger capacity types, in addition to the standard types.
- Features a standard mechanical door lock mechanism and door lock safety mechanism.
Conforms to various testing standards for semiconductors
IEC 60068-2-66 Compact electrical and electronic components (mainly non-hermetically sealed components)
IEC 60749-4 Semiconductor devices
EIAJ ED-47001 Semiconductor devices
JESD22-A110E Non-hermetically sealed (not hollow) device
JESD22-A102E Non-hermetically sealed IC discrete device
*We recommend the M type chambers for tests conforming to the above testing standards.
Conforms to other testing standards
JIS C 60068-2-66 Aluminum metal corrosion of integrated circuits and semiconductor devices.
JPCA-ET08-2002 Printed circuit boards.
Contact us at (049) 544-1111 or email us at sales@edgeworthcorp.com for more details.
Hey!! Are you a hands-on Saw Engineer, much more on Accretech AD series, and Still wanting to absorb more on its technology and CURIOUS to know what is PLUS????……….. Man, you are in the right place at the right time!!!!!!
Plus???, Hmmm.. Mark your calendar and visit Edgeworth Laguna Inc.
We are requesting the pleasure of your Company @ the EDGEWORTH AD3000T PLUS LAUNCHING on July 18, 2019, at 1 PM. The event will be held at Edgeworth Laguna Office with an address of Unit D Lot 5, 121 East Main Avenue, Laguna Technopark-SEZ, Biñan, Laguna 4024.
RSVP on or before July 11, 2019
Send your RSVP to the following emails:
Imelda B. Bolante – Sales Coordinator
Contact No.: 0917-598-5510
Email: mel.bolante@edgeworthcorp.com
Racell Y. Matibag – Service Coordinator
Contact No.: 0917-598-5523
Email: racell.matibag@edgeworthcorp.com
Location:
