Fully Automatic High Rigid Twin Axis Grinder Model: HRG3000RMX

Accretech High Rigid Grinders enable mirror finishing with no use of chemicals and contribute to achieving high precision, high throughput and low cost in the wafer thinning process.

Features:

Fully Automatic High Rigid Twin Axis Grinder
Less-damage Grinding with Shorter Process Time
Low processing cost
High Accuracy
Mirror Finish Surface Grinding
12″ & 8″ wafer size capability
Slurry less process
Minimum Thickness capability: 20μm