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process where the semiconductor devices, packaged or bare die are subjected to an electrical test to simulate functionality.
Automatic Checker System: DS Series
Pick & Place Test Handler: PUPPY-301H
Pick & Place Test Handler: EXCEED-8808 (Tri-temp)
System Level Test Handler: SUMMIT-3000
Pick & Place Test Handler: COLLIE-301HC
(NEW) Stationary Surface Probe: AX Series
(NEW) Compact Thermologger: AM-9000 Series
Open-Short Test Total Solution (OTS): OTS-05000/1000
Wafer Probing Machine: UF3000ex-5
Internal Probes for Food: Model BC Series
Pick & Place Test Handler: EXCEED-6000 Series
Pick & Place Test Handler: EXCEED-8016H
Wafer Probing Machine: AltaProv
High-Volume Testing: Model DG Series
Manual Press System: Model P series
Manual PCB Checker: Model E series
Infrared Thermometer: Model AR-6500 series
Wafer Prober: UF190R
Wafer Prober: UF200R
Wafer Prober: UF2000
Wafer/Film Frame Prober: FP2000
Wafer/Film Frame Prober: FP3000
Wafer Prober: UF3000EX-e
Wafer Prober: UF3000EX
Final Visual Inspection: TY-Vision M100S
Final Visual Inspection: TY-Vision A500D
Fully-automatic Bare Board: DIGITALGALXAY 650
Fully-automatic Bare Board: TY-Auto BGA
StarFiber 180 FC OEM
StarFiber 150P/300P
StarFiber 100-600
ComboLine Basic
Class 100
Standard Industrial Ovens
TSE-100
Magnetic Probes: Model MG series
General Stationary Surface Probes: Model A series
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