Wafer Prober: UF3000EX-e

Sharing the fundamental structure with UF3000EX, the prober offers high-cost performance.

 

For more details, contact us at (049) 544-1111 or send us your inquiries at dennish.solis@edgeworthcorp.com.

1. High throughput is realized by synergetic effect of XY stage with high-speed and great quietness created by the high-speed wafer handling and exclusive driving unit. Furthermore, Z axis achieved the load bearing and high precision of the world’s highest standard.

2. It is equipped with high-magnification optical system of the color camera, and improved the operability by adopting large display with the original operability.

3. It can adopt every testing environment with flexibility by combining wide variety of options.

4. QPU – Super High-rigid Chucking (Quad-Pod Unit)

To effectively attain the accuracy in positioning, the high rigidity of every part is greatly important.

The UF3000 uses the new technology of 4 axes driving mechanism (QPU) for Z-axis, enabling the high-rigid, stable probe contact.

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5. TTG (Touch To Go)

Pursuing the easy operation, the UF3000 adopts the function to move to the position you touch on the map or image shown on the touch panel.

Setting up is easy, and screen configuration is possible by the user definition.

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Applicable wafesWafer size 200mm, 300mm
Thickness 300 to 1000um
Thickness Variation +/-50um max.
Die size 0.2mm to 100mm (not exceeded to 1,000,000 chips)
Overall precision
Multi-probing Maximum sites 256 sites
Probe area +/-170mm max
Stage precision +/-0.5um
X, Y axisResolution 0.5nm (0.0005um)
Max. speed XY : 500mm/s
Static load withstand (horizontally) 20kgf
Max. stroke 37mm
Probing standard stroke 0.2mm
Stage accuracy +/-2.0um
Z axisControl resolution 0.167um
Max. speed 30mm/s
Withstanding load 200kgf
Rigidity Inclination rigidity (Hot chuck) (4.7um)/(10kgf)
Theta axis Rotation range +/-4degree
Resolution0.0000276degree
F axisMax. stroke 39mm
Control resolution 0.125um
Withstanding load 200kgf
Method ITV camera pattern matching system
Fine alignment Lighting LED light, coaxial and oblique lighting
Visibility Low mag 3.33 x 3.12mm
High mag 0.51 x 0.48mm
Screen size15 - inch
Alignment image colorColor
Liquid crystal DisplayDisplay color16770000 colors
Display area 1024 x 768 pixels
Touch switch 1024 x 1024 dot matrix
Handling methodCeramic Arm
LoaderNo. of cassette stored1
Applicable cassette / FOUP- 300mm FOUP, FOSB, open cassette conform to SEMI standard
- 200mm open cassette
Voltage 200/220/230/240VAC
MiscellaneousPower consumption 3.0kVA (max.)
Air pressure0.6 to 0.99MPa
Vacuum pressure-100 to -53kpa
Width1,525mm
DimensionDepth1,622mm
Height967mm (1,422mm including loadport)
WeightApproximately 1,650kg