Fast soldering with less corrosion of soldering tip and less flux spattering which will provide greater productivity
Fast soldering with less corrosion of soldering tip and less flux spattering which will provide greater productivity
1. Excellent solderability and wettability properties
2. Fast soldering and low fuming/odor phenomena
3. Low spattering of flux and solder particles
4. High reliability and surface insulation resistance
| JIS-Z73283 / RA | RX-115A-1 | 0.45-0.55 | For base materials which difficult to solder |
| J-STD-004 / ROL1 | - High Soldering efficiency on metals substrate such as stainless, stesls, nickels, and etc. | ||
| - High halide content, 0.45 - 0.55% | |||
| JIS-73283/ RMA | RX-90-RMA | 0.08-0.12 | All purpose solution |
| - High soldering efficiency in most base metals substrate | |||
| - Moderate halide content, 0.08 - 0.12 % | |||
| - Less corrosive characteristic | |||
| -High reliability | |||
| JIS-73283 / No clean | RX-100-NC | None | For no clean purpose |
| - No halide content | |||
| - High soldering efficiency in Cu Base substrate | |||
| -High Reliability |
