Solder Ball is key part of a semiconductor packaging technology like BGA and CSP. Solder ball is technology-intensive product that transmit electrical signals by connecting chips and boards.
For more details, contact us at (049) 544-1111 or send us your inquiries at tracy.crisostomo@edgeworthcorp.com.
1. Provides high-quality products that can realize smaller size, lighter weight and higher
function of semiconductors and mobile devices using a self-developed unique method
2. Various compositions and diameters on demand
3. Strict dimensional and dispersion management
4. Customized products for other industry
