Grinder + CMP stress release High throughput wafer handling 15umt wafer thickness in mass-producing.
For more details, contact us at (049) 544-1111 or send us your inquiries at sales@edgeworthcorp.com.
Grinder + CMP stress release High throughput wafer handling 15umt wafer thickness in mass-producing.
For more details, contact us at (049) 544-1111 or send us your inquiries at sales@edgeworthcorp.com.
Grinder + CMP stress release High throughput wafer handling 15umt wafer thickness in mass production.
To produce a wafer of the required thinness, the back surface of a wafer with a patterned surface covered by protective tape is finely finished with a grinder and polisher. As semiconductor wafer manufacturing demands thinner and thinner wafers, conventional grinders alone cannot meet production needs. Accretech’s PG series can polish extremely thin wafers and attaching the RM, unload wafers by applying them to the dicing frame.
1. Non Contact Inprocess Gauge (NCIG) and Auto TTV
– Current Contact Type Gauge measures wafer thickness includes BG tape. BG tape has thickness variations and it may affect to Wafer Thickness Measurement. NCIG can measure only Silicon Wafer Thickness, so that BG tape Thickness Variation can be ignored. The wafer shape can be compensated by Auto TTV function.
2. Extrinsic gettering Function (EGF)
– When the Grinding and Stress Relief is simultaneously processed from backside of wafer, the capturable layer is also getting reduced and then the metal ion will be affected to transistor. Accretech provides the EGF by Texturing Process. It enables achieving gettering Function and Die strength for ultra thin wafer.
3. Wafer Cleaning System (WCS)
– Accretech propose various wafer cleaning systems for the device such as CMOS image sensor, LCD driver and TSV etc.
4. ML DICER Inline System (Integration System)
– Accretech propose integration system with laser dicer onto Polish grinder. Applying “GAL” process may users obtain 25um thickness chips without any defect.
1. Grinding Wheels
2. Dressing Disk (TB325 and TB2000)
3. Polishing Pad
– TP200V4 (for PG200)
– TP300V4 (for PG300/PG3000)
4. Polishing Slurry
– TS200L (Standard)
– TS200H (low contamination)
– TS200S (High throughput)
