12-inch laser dicing machine with wafer handling system achieved high performance to respond to various customer’s needs.
For more details, contact us at (049) 544-1111 or send us your inquiries at sales@edgeworthcorp.com.
12-inch laser dicing machine with wafer handling system achieved high performance to respond to various customer’s needs.
For more details, contact us at (049) 544-1111 or send us your inquiries at sales@edgeworthcorp.com.
LASER DICING MACHINE.
– High performance laser dicing machine for 300mm wafers.
| Applicable Wafer size | Circular wafer: Φ 8" to Φ 12" | |
| Stroke | 550 mm | |
| X axis | Cutting feed rate | 0.1 to 600 mm/s |
| Positioning resolution | 0.002 mm | |
| Straightness | 0.0015mm/310mm (both horizontal and vertical) | |
| Stroke | 427 mm | |
| Y axis | Driving speed | Max 80mm/s |
| Positioning resolution | 0.0002mm (closed-loop control) | |
| Positioning accuracy | 0.002 mm / 310 mm | |
| Stroke | 8.5mm | |
| Z axis | Driving speed | Max 10mm/s |
| Positioning resolution | 0.0001mm (closed-loop control) | |
| Positioning accuracy | 0.001 mm/1mm | |
| Voltage | Selectable from: 200/220/240/380/415 VAC ±10 % 3 Phase, 50 to 60 Hz | |
| Power consumption | 7.0kVA (MAX) | |
| Miscellaneous | CDA pressure | 0.55 to 0.7 MPa |
| N2 gas | 0.55 to 0.7 MPa | |
| Cooling water for thermal regulator (for Laser cooling) | 0.2 to 0.5 MPa | |
| Size (W*D*H) | 1630mmX2345mmX2190mm | |
| Weight | 2500 kg |
