1. It performs the precision measurement using our unique correction technology on cut wafer, package and such that are attached to the dicing frame.
2.It is the multi-functional prober which perfoms transfer and testing on a frame as well as wafer of 8 to 12 inches.
3. The prober’s total X/Y axis positioning precision is +/-1.5um.
4. The high rigidity cleaning stage combines with large plate enables cleaning by cleaning stage on large card such as multi-cards, etc.
5. Throughput is improved by the new linear motor drive XY stage with its ability of control vibration generated from accelaration and high speed operation