Wafer/Film Frame Prober: FP2000

Machine ready for tape frame transportation. The Prober developed base on the high-end 200mm Prober UF2000, which adopt the frame handling.

 

For more details, contact us at (049) 544-1111 or send us your inquiries at dennish.solis@edgeworthcorp.com.

1. It performs the precision measurement using our unique correction technology on cut wafer, package and such that are attached to the dicing frame.

2.It is the multi-functional prober which perfoms transfer and testing on a frame as well as wafer of 5 to 8 inches with only one click of button.

3. The prober’s total X/Y axis positioning precision is +/-1.5um.

4. High-rigidity “TRIPOD” Z/θ stage to realize stable high pin count or multi measurement highly evaluated Z/theta stage “TRIPOD” drives by three ball screws, improved the rigidity even more, and it can ensure enough stability for further multi-pin, multi-measurement.

5. The high rigidity cleaning stage combines with large plate enables cleaning by cleaning stage on large card such as multi-cards, etc.

Wafer size 5", 6", 8" (only wafer)
4", 5", 6", 8" (with frame)
Thickness 300um to 1000um (not warped)
20um to 2000um (with frame)
Applicable wafesThickness Variation +/-50um max.
Frame (Dicing ring) 2-8-1, 2-6-1
Die size 0.2mm to 100mm (not exceeded to 1,000,000 chips)
Overall precision +/-1.5um
Multi-probing Maximum sites 64 site (2048 sites option is available)
Probe area+/-120mm max.
X, Y axisStage precision +/-1.5um
Resolution 0.1um
Max. speed X : 250mm/s, Y : 200mm/s
Max. stroke 47mm
Probing standard stroke 0.2mm
Z axisStage accuracy +/-2.0um
Control resolution 0.25um
Max. speed 30mm/s
Withstanding load 120kgf
Theta axisRotation range+/-5degree
Resolution 0.00007degree
Method ITV camera pattern matching system
Fine alignmentLighting LED light, coaxial and oblique lighting
VisibilityLow mag 3.33 x 3.12mm
High mag 0.51 x 0.48mm
Screen size 12.1 - inch
Alignment image color Black and white
Liquid crystal DisplayDisplay color 650000 colors
Display area 800 x 600 pixels
Touch switch 1024 x 1024 dot matrix
Handling method Ceramic transfer Arm
Transfortation weight 0.5kg max. including frame
LoaderCassette 1
Applicable cassette /FrameWafer: SEMI standard
Frame: 6", 8" (25slots)
Voltage 100/200/210/220/230/240VAC 50/60Hz
MiscellaneousPower consumption 1.3kVA max. including hot chuck
Air pressure 0.45 to 0.7MPa
Vacuum pressure -100 to -53kpa
Width 1,322mm
DimensionDepth 1,454mm
Height 943mm
Weight Approximately 900kg