Flip Chip Bonder: CB-1800

COF ultrasonic bonding system capable reel supply, the first in the industry.

 

For more details, contact us at (049) 544-1111 or send us your inquiries at tracy.crisostomo@edgeworthcorp.com.

1. It is possible to set dispenser head up with option before bonding process
2. Equipped automatic head cleaning mechanism for dispenser head
3. In-line configuration with our COF potting system, MS-1890, applicable
to under-fill application

Tape Width : 35 mm, 48 mm, 70 mm

Tape Thickness : 0.025 – 0.125 mm

Bonding Pitch : 2 – 20 PF