Tokyo Japan – Panasonic Corporation and Tokyo Seimitsu Co, Ltd (Hereinafter Tokyo Seimitsu) Today announced that Tokyo Seimitsu and Panasonic’s subsidiary’s company, Panasonic Smart Factory Solutions Co, Ltd (hereinafter PSFS) have started taking orders for the AL300P, Laser patterning machine for Plasma Dicing process jointly developed by the two companies. The AL300P is a new product design for the Plasma dicing process that achieves chips to be diced from a silicon wafer without damage.
This is a Laser patterning machine developed exclusively for PSFS’s Plasma dicing machine (APX300). The ALP300 enables a silicon wafer, to which a resist or other mask layer is attached in the pre-processing stage of Plasma dicing to be patterned at the dicing position with the specified width and high precision through UV laser processing.
Key Features of the New Product:
Tokyo Seimitsu’s Laser Patterning Machine – AL300P
-This is a laser patterning developed exclusively for PSFS’s Plasma Dicing Machine (APX300). The AL300P enables a silicon wafer, to which a resist or other mask layer is attached in the pre-processing stage of Plasma dicing, to be patterned to
Plasma Dicing Process Flow
