Fully Automatic High Rigid Twin Axis Grinder: HRG3000RMX

Accretech High Rigid Grinders enable mirror finishing with no use of chemicals and contribute to achieving high precision, high throughput and low cost in the wafer thinning process.

 

For more details, contact us at (049) 544-1111 or send us your inquiries at tracy.crisostomo@edgeworthcorp.com.

  • Fully Automatic High Rigid Twin Axis Grinder
  • Less-damage Grinding with Shorter Process Time
  • Low processing cost
  • High Accuracy
  • Mirror Finish Surface Grinding
  • 12″ & 8″ wafer size capability
  • Slurry less process
  • Minimum Thickness capability: 20μm