Wafer Prober: UF2000

High-end Prober for 5-inch to 8-inch wafer which achieves both precision and throughput in high dimension.

 

For more details, contact us at (049) 544-1111 or send us your inquiries at dennish.solis@edgeworthcorp.com.

1. Improved high rigidity and high speed operation technology contribute to the better precision and throughput

2. Extremely accurate Prober having positioning accuracy of 1.5μm including the X/Y axes.

3. Highly evaluated Z/theta stage “TRIPOD” drives by three ball screws, improved the rigidity even more, and it can ensure enough stability for further multi-pin, multi-measurement

4. Automatic setup functions including automatic probing and probe/wafer alignment functions.

5. Large storage media eases the works such as upgrading the system software and also can back up device parameter and measurement result in HDD easily.

6.Variety of options enables all kinds of wafer tests that are not standard in this industry.

Wafer Diameter 5", 6" and 8" and 4" is optionally available
Thickness 150 to 1000um (not warped)
Applicable wafesThickness Viration +/-50um max.
Die size 0.25mm to 100mm (0.1um graduations)
Overall precision Within +/-1.5um
Multi-probingMaximum sites64 site (2048 sites option is available)
Probe area Max. +/-120mm
X, Y axisResolution 0.1um
Resolution X:250mm/sec, Y:200mm/sec
Max. stroke 47mm
Stage accuracy +/-2.0um
Z axisResolution 0.25um
Max. speed 30mm/s
Load-carrying capacity 120kgf
Capable for 1 touch probe testing450 kgf
Theta axisRotation range +/-5degree
Resolution 0.00007degree
Fine alignment unitPrincipal system Pattern matching with ITV camera
Lighting LED light, coaxial and oblique lighting
Field of view Low mag: Approx. 3.33 x 3.12mm
High mag: Aprprox. 0.51 x 0.48mm
Screen size 12.1 - inch
Alignment image color Black and white
Liquid crystal DisplayDisplay color 650 thousand colors
Display area 800 x 600 pixels
Touch switch 1024 x 1024 dot matrix
Handling method Ceramic transfer Arm
LoaderNo. of cassette stored Single loadport
Applicable cassette / FOUP Based on SEMI standards
Voltage 100VAC 50/60HZ (supply voltage should be confirmed before an order
Miscellaneous Power consumption 1.3kVA (hot chuck includes)
Air pressure 0.45 to 0.7MPa
Vacuum pressure -100 to -53kpa
Width 1,142mm
DimensionDepth 1,229mm
Height 933mm
Weight Approximately 800kg