1. It performs the precision measurement using our unique correction technology on cut wafer, package and such that are attached to the dicing frame.
2.It is the multi-functional prober which perfoms transfer and testing on a frame as well as wafer of 5 to 8 inches with only one click of button.
3. The prober’s total X/Y axis positioning precision is +/-1.5um.
4. High-rigidity “TRIPOD” Z/θ stage to realize stable high pin count or multi measurement highly evaluated Z/theta stage “TRIPOD” drives by three ball screws, improved the rigidity even more, and it can ensure enough stability for further multi-pin, multi-measurement.
5. The high rigidity cleaning stage combines with large plate enables cleaning by cleaning stage on large card such as multi-cards, etc.