Wafer Dicer (Full-Auto): AD2000T/S

8-inch fully automatic dicing machine. Achieved smallest footprint possible utilizing our own core technology.

 

For more details, contact us at (049) 544-1111 or send us your inquiries at sales@edgeworthcorp.com.

1. Optimized spacing by utilizing all components and optional units well within the compartment.

2. Standard Spindle up to 60,000 rpm

3. Enhanced throughput
– X-axis 1,000 mm/sec, Y-axis 300 mm/sec and Z-axis 80 mm/sec
– Two Optical Cutter Set Units
– The World’s smallest blade to blade distance
4. 17″ LCD touch panel and new GUI(Graphical User Interface) with a simple layout and large touch-buttons
allow users’ interactive operation

5. Easy and simple kerf check function (AI kerf check function)

6. Over 10,000 recipes storable

7. USB port as standard (USB memory device can be used as external memory)

8. Ease-of-maintenance. Wide maintenance door and front-side accessibility allows easy of routine
maintenance

9. Optimized vacuum controller. Reduce 50% of air consumption compared with the existing model

Max. work size Φ200 mm
Max. frame size 8 inch
Rotation 60,000 rpm
Spindle Max blade diameter Φ58 mm (2-inch)
Rated Output 1.8 KW
X axis Available cutting range 260 mm
Max. Speed 1000 mm/s
Available cutting range 260 mm
Y1/Y2 axes Max. Speed 300 mm/s
Resolution0.078 μm
Accuracy0.002 mm / 210 mm
Stroke34 mm
Z1/Z2 axesResolution0.002 μm
Max. Speed80 mm/sec
Repeatability0.001 mm
Theta axis Range of rotation380°
Voltage3 Phase AC200 to 220 V ±10 %, (Transformer adoptable)
Power consumption 6.0kVA (MAX)
Air pressure0.55 to 0.7 MPa
Avg. Air consumption210 L/min (0.55 MPa)
MiscellaneousCutting Water, and others (pressure)0.3 to 0.5 MPa
Cutting Water,and others (Max Flow)Cutting Water:10.0 L/min Water curtain:3.0 L/min Others: 0.6 L/min
Cooling water pressure0.3 to 0.5 MPa
Cooling water Max Flow3.4 L/min (0.3 MPa)
Exhaust5.0 m3/ min more
Size (W*D*H)1080mmX1190mmX1900mm
Weight 1100 kg